Microgrid systems that combine cooling, heating and power (CHP) with distributed cogeneration units and renewable energy sources are a practical way to meet the growing need for energy, and industrial parks have enormous potential for the development of integrated electrical and thermal systems. This paper presents a microgrid CHP model and evaluates the possibility of developing the model in the Dong Nam industrial park in Ho Chi Minh City, Vietnam. HOMER software was used to evaluate the effectiveness of the model.

Tran Q.T., Roose L., Nguyen N.Q., Van B.D., Zizzo G., Riva Sanseverino E. (2023). The possibility of applying combined heat and power microgrid model for industrial parks. A case study for Dong Nam industrial park in Vietnam. In Conference Record - Industrial and Commercial Power Systems Technical Conference (pp. 1-5). Institute of Electrical and Electronics Engineers Inc. [10.1109/ICPS57144.2023.10142127].

The possibility of applying combined heat and power microgrid model for industrial parks. A case study for Dong Nam industrial park in Vietnam

Zizzo G.;Riva Sanseverino E.
2023-01-01

Abstract

Microgrid systems that combine cooling, heating and power (CHP) with distributed cogeneration units and renewable energy sources are a practical way to meet the growing need for energy, and industrial parks have enormous potential for the development of integrated electrical and thermal systems. This paper presents a microgrid CHP model and evaluates the possibility of developing the model in the Dong Nam industrial park in Ho Chi Minh City, Vietnam. HOMER software was used to evaluate the effectiveness of the model.
2023
Settore ING-IND/33 - Sistemi Elettrici Per L'Energia
979-8-3503-9651-5
Tran Q.T., Roose L., Nguyen N.Q., Van B.D., Zizzo G., Riva Sanseverino E. (2023). The possibility of applying combined heat and power microgrid model for industrial parks. A case study for Dong Nam industrial park in Vietnam. In Conference Record - Industrial and Commercial Power Systems Technical Conference (pp. 1-5). Institute of Electrical and Electronics Engineers Inc. [10.1109/ICPS57144.2023.10142127].
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/10447/600074
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