In this paper, a review of the existing special bonding techniques for medium voltage (MV) and high-voltage (HV) cables is presented. Special bonding techniques have the purpose of reducing sheath currents, thereby limiting copper losses and the reduction of the ampacity of cables. The authors present a literature review to identify various bonding techniques and how these have evolved over the years thanks to new technologies. Simulations of the most used techniques have been performed in Matlab/Simulink, to compare their strengths and drawbacks.

Candela R., Gattuso A., Mitolo M., Riva Sanseverino E., Zizzo G. (2020). A Comparison of Special Bonding Techniques for Transmission and Distribution Cables. In Proceedings - 2020 IEEE International Conference on Environment and Electrical Engineering and 2020 IEEE Industrial and Commercial Power Systems Europe, EEEIC / I and CPS Europe 2020 (pp. 1-6). Institute of Electrical and Electronics Engineers Inc. [10.1109/EEEIC/ICPSEurope49358.2020.9160549].

A Comparison of Special Bonding Techniques for Transmission and Distribution Cables

Riva Sanseverino E.;Zizzo G.
2020-01-01

Abstract

In this paper, a review of the existing special bonding techniques for medium voltage (MV) and high-voltage (HV) cables is presented. Special bonding techniques have the purpose of reducing sheath currents, thereby limiting copper losses and the reduction of the ampacity of cables. The authors present a literature review to identify various bonding techniques and how these have evolved over the years thanks to new technologies. Simulations of the most used techniques have been performed in Matlab/Simulink, to compare their strengths and drawbacks.
2020
978-1-7281-7455-6
Candela R., Gattuso A., Mitolo M., Riva Sanseverino E., Zizzo G. (2020). A Comparison of Special Bonding Techniques for Transmission and Distribution Cables. In Proceedings - 2020 IEEE International Conference on Environment and Electrical Engineering and 2020 IEEE Industrial and Commercial Power Systems Europe, EEEIC / I and CPS Europe 2020 (pp. 1-6). Institute of Electrical and Electronics Engineers Inc. [10.1109/EEEIC/ICPSEurope49358.2020.9160549].
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/10447/436659
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