We are developing a method to build arrays of Ge-based microcalorimeters for soft X-rays detection using micro-photolithographic techniques. A key element of the process is the electrical and thermal connection between the germanium sensors and the interconnection electrical tracks, that lay on a substrate acting as mechanical support and thermal sink. The geometry of the sensors, that have a square base truncated pyramid shape, makes feasible a connection through indium soldering. We describe a technique, based on microlithography and electroplating, adopted to grow indium bumps of a few tens of square microns of area and several microns high on top of the contact pads patterned on the substrate. The sensor array is placed over the bumps and a subsequent baking melts the indium, soldering the sensors to the pads.

Lo Cicero, U., Arnone, C., Barbera, M., Collura, A., & Lullo, G. (2012). Electroplated Indium Bumps as Thermal and Electrical Connections of NTD-Ge Sensors for the Fabrication of Microcalorimeter Arrays. JOURNAL OF LOW TEMPERATURE PHYSICS, 167(3-4), 535-540 [10.1007/s10909-012-0560-4].

Electroplated Indium Bumps as Thermal and Electrical Connections of NTD-Ge Sensors for the Fabrication of Microcalorimeter Arrays

ARNONE, Claudio;BARBERA, Marco;LULLO, Giuseppe
2012

Abstract

We are developing a method to build arrays of Ge-based microcalorimeters for soft X-rays detection using micro-photolithographic techniques. A key element of the process is the electrical and thermal connection between the germanium sensors and the interconnection electrical tracks, that lay on a substrate acting as mechanical support and thermal sink. The geometry of the sensors, that have a square base truncated pyramid shape, makes feasible a connection through indium soldering. We describe a technique, based on microlithography and electroplating, adopted to grow indium bumps of a few tens of square microns of area and several microns high on top of the contact pads patterned on the substrate. The sensor array is placed over the bumps and a subsequent baking melts the indium, soldering the sensors to the pads.
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Lo Cicero, U., Arnone, C., Barbera, M., Collura, A., & Lullo, G. (2012). Electroplated Indium Bumps as Thermal and Electrical Connections of NTD-Ge Sensors for the Fabrication of Microcalorimeter Arrays. JOURNAL OF LOW TEMPERATURE PHYSICS, 167(3-4), 535-540 [10.1007/s10909-012-0560-4].
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/10447/63649
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