A microlithographic process suited for metal patterning on cylindrical dielectric substrates has been developed. This includes all steps from metal coating to final etching, with resolution in the 5 μm range.

Lullo G., Arnone C., & Giaconia G.C. (1997). Technologies for the fabrication of cylindrical fine line devices. MICROELECTRONIC ENGINEERING, 35(1-4), 417-420 [10.1016/S0167-9317(96)00118-9].

Technologies for the fabrication of cylindrical fine line devices

Lullo G.;Arnone C.;Giaconia G. C.
1997

Abstract

A microlithographic process suited for metal patterning on cylindrical dielectric substrates has been developed. This includes all steps from metal coating to final etching, with resolution in the 5 μm range.
Settore ING-INF/01 - Elettronica
Lullo G., Arnone C., & Giaconia G.C. (1997). Technologies for the fabrication of cylindrical fine line devices. MICROELECTRONIC ENGINEERING, 35(1-4), 417-420 [10.1016/S0167-9317(96)00118-9].
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/10447/427584
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