A quantitative investigation of a dipping technique for depositing a thin layer of resist on circularly symmetrical objects is presented. The results obtained are valuable for preparing three-dimensional (3-D) surfaces suited for spatial microlithographic processes in the 1 to 10 μm linewidth range. © 1995, MCB UP Limited

Giaconia G.C., Grasso G., & Arnone C. (1995). Resist Coating of Cylindrical Samples for 3-D Lithography. MICROELECTRONICS INTERNATIONAL, 12(1), 22-24 [10.1108/eb044552].

Resist Coating of Cylindrical Samples for 3-D Lithography

Giaconia G. C.;Arnone C.
1995

Abstract

A quantitative investigation of a dipping technique for depositing a thin layer of resist on circularly symmetrical objects is presented. The results obtained are valuable for preparing three-dimensional (3-D) surfaces suited for spatial microlithographic processes in the 1 to 10 μm linewidth range. © 1995, MCB UP Limited
Settore ING-INF/01 - Elettronica
Giaconia G.C., Grasso G., & Arnone C. (1995). Resist Coating of Cylindrical Samples for 3-D Lithography. MICROELECTRONICS INTERNATIONAL, 12(1), 22-24 [10.1108/eb044552].
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/10447/425921
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